CTO – Product and Engineering — Packaging And Test Network

The mandate

The board has concluded that incremental adjustment will not resolve product engineering requiring a step-change in pace without compromising reliability within a listed fabless, foundry or semiconductor-systems enterprise. The immediate arena is the packaging and test network during a design-win conversion gap. For mandate 541, the successful executive inherits decisions that have been deferred, competing stakeholder expectations and a need to establish facts before committing further capital.

The CTO – Product and Engineering operating perimeter covers approximately ₩9,500 billion in design, manufacturing and customer programme portfolio, with activity spanning several packaging and test network customer, product and delivery clusters rather than a single asset. The CTO – Product and Engineering Semiconductor remit carries direct influence over roughly 625 colleagues and third-party capacity.

The chair, executive committee and principal capital sponsors want a CTO – Product and Engineering who can convert ambiguity into a short list of explicit choices for the packaging and test network. The CTO – Product and Engineering Semiconductor seat must resolve a design-win conversion gap, while preserving the underlying strengths of the packaging and test network. For mandate 541, value will come through sharper allocation, stronger leaders and an operating cadence that exposes variance early.

The CTO – Product and Engineering’s first year on the packaging and test network is expected to end with release confidence, architecture health and engineering productivity. In mandate 541, authority covers resources and leadership appointments; material trade-offs go directly to the board sponsor.

Why this seat is open

This is a newly created CTO – Product and Engineering — Packaging And Test Network seat, established because a design-win conversion gap now requires one accountable executive rather than distributed ownership. The board has classified the appointment as urgent and intends to move from qualified shortlist to offer within 6–8 weeks. Interim governance protects the packaging and test network, but it is not a substitute for a permanent appointee. The external search remains confidential to avoid unnecessary disruption before the appointment is agreed.

What you will own

• Set the CTO – Product and Engineering value-creation thesis for the packaging and test network, translate it into no more than five enterprise priorities and stop work that does not support them.
• Carry stewardship of approximately ₩9,500 billion in design, manufacturing and customer programme portfolio, including allocation, risk acceptance and board forecasts.
• Lead the CTO – Product and Engineering Semiconductor organisation of about 625 employees and partners, appointing a team with clear decision rights and credible succession for every critical seat.
• Resolve the packaging and test network economics and execution constraints created by a design-win conversion gap, with CTO – Product and Engineering-approved owners, dated milestones and transparent escalation thresholds.
• Establish one CTO – Product and Engineering operating review across commercial, customer, financial, people, technology and risk outcomes for the packaging and test network; remove reconciliations that obscure accountability.
• Have made consequential architecture and engineering trade-offs while scaling release throughput and reliability in mandate 541.
• Build the CTO – Product and Engineering’s three-year succession and capability plan for the packaging and test network, reducing dependence on individual executives and improving mobility across the wider Semiconductor organisation.

The first 12 months

• Days 1–90: Validate the packaging and test network baseline, meet the 30 stakeholders most consequential to product engineering requiring a step-change in pace without compromising reliability, assess the leadership team, stabilise immediate delivery risks and agree a board-owned scorecard with explicit decision gates.
• Months 4–9: Make the principal CTO – Product and Engineering portfolio and organisation choices for the packaging and test network, install the new operating cadence, fill critical leadership gaps and deliver the first measurable release of cash, capacity or customer value.
• Months 10–12: Demonstrate a repeatable packaging and test network trend against release confidence, architecture health and engineering productivity, lock the following year’s capital and talent plan, evidence control sustainability and present a credible three-year value case with downside actions.

What the board will measure

• Delivery of the CTO – Product and Engineering’s agreed first-year packaging and test network value case within a 10% tolerance, with variance explained before rather than after the relevant quarter closes.
• A CTO – Product and Engineering forecast that remains decision-useful across three consecutive quarters and reconciles the packaging and test network’s operating, cash, customer and people assumptions.
• Closure of the CTO – Product and Engineering mandate’s highest-priority packaging and test network risk and execution issues by their board-approved dates, with independent evidence that fixes are sustained.
• Retention of at least 90% of critical packaging and test network talent and ready-now successors for at least 70% of the CTO – Product and Engineering’s direct reports.
• A quantified CTO – Product and Engineering-owned improvement in the packaging and test network operating constraint behind a design-win conversion gap, supported by a clean baseline and named data owner.
• Clear stakeholder confidence in mandate 541: no unresolved high-severity escalation older than 30 days and no material surprise withheld from its agreed governance forum.

The person

You are currently a CTO, SVP Engineering or Product Technology Head in a listed Semiconductor or adjacent enterprise. In relation to the packaging and test network, your CTO – Product and Engineering track record includes a transition where the original plan was no longer sufficient; you can explain your choices, evidence and numerical impact. Candidates from semiconductors, electronics, embedded systems, advanced manufacturing or engineering services will be considered where the operating model, customer stakes and governance intensity match this CTO – Product and Engineering brief.

As a CTO – Product and Engineering candidate, you bring 18–22 years of progressive Semiconductor or adjacent-sector experience, consistent with the 18-22 experience band. At minimum, you have carried a P&L, book, budget or accountable portfolio of ₩5,500 billion and led an organisation of at least 500 people.

For mandate 541, the board wants two transitions: a difficult packaging and test network portfolio choice and a leadership-system change during a design-win conversion gap. As the prospective CTO – Product and Engineering for this packaging and test network, you must challenge optimistic cases and still create followership. References for mandate 541 must distinguish your contribution from the institution around you.

The CTO – Product and Engineering must be based in Seoul; international relocation is supported, but this Semiconductor role is not designed as a remote appointment.

Non-negotiables

• Current or recent accountability at the level of CTO, SVP Engineering or Product Technology Head, with direct exposure to a board, investment committee or equivalent Semiconductor governance forum.
• Proven CTO – Product and Engineering ownership of at least ₩5,500 billion and leadership of no fewer than 500 employees in a comparable packaging and test network context.
• One completed Semiconductor or adjacent-sector example of product engineering requiring a step-change in pace without compromising reliability with outcomes sustained for at least two reporting periods after the initial intervention.
• Sector credibility from semiconductors, electronics, embedded systems, advanced manufacturing or engineering services; experience that is purely functional and lacks CTO – Product and Engineering-level packaging and test network consequences will not meet the bar.
• Willingness to meet the Seoul location expectation, complete conflicts and background diligence, and protect the confidentiality of mandate 541.

Compensation and terms

The anticipated CTO – Product and Engineering package is ₩580–800 million base + annual incentive and equity, calibrated to the final packaging and test network scope and the candidate’s current mix. Any long-term participation for mandate 541 follows standard vesting and performance conditions. The CTO – Product and Engineering appointment in Seoul, centred on the packaging and test network, offers regular exposure to the chair, executive committee and principal capital sponsors. A notice period of up to 6 months can be accommodated for the selected executive in mandate 541.

Confidentiality

The organisation will be identified only after reciprocal interest and a confidentiality undertaking for mandate 541. The market, scale and situation in this brief are intentionally composite and are not a coded description of a named enterprise for mandate 541.