Chief Operating Officer — Interim, Semiconductor Assembly and Test

The mandate

A strategic customer's automotive package failed reliability qualification after hidden wire-bond variation, and the COO was removed when traceability gaps surfaced. Ramp commitments now exceed the operation's demonstrated process capability.

The interim must join within three weeks for twenty-four months, spanning corrective qualification and sustained high-volume production. The role returns to a newly structured permanent team once customers accept both process and leadership readiness.

Handover requires automotive qualification passed, final yield above ninety-four per cent for six months, zero uncontained critical escapes, overall equipment effectiveness above seventy-eight per cent, and permanent site leaders completing two customer audits unaided.

The COO may stop lots, change production allocation, approve containment below ₹2 crore and move engineering capacity among lines. Capital above ₹10 crore, permanent vice-president appointments and customer liability settlements require board approval; Quality retains independent release and deviation authority.

Wafer fabrication, chip design and commercial price negotiation are outside scope. The mandate covers assembly, test and the operating controls needed to ship qualified product reliably.

Why this seat is open

The failed qualification demonstrated that reported yield concealed process tails and incomplete genealogy. Existing leadership cannot credibly assure automotive customers while investigation continues. A long but finite operator must rebuild evidence, ramp safely and certify a permanent team in live customer scrutiny.

What you will own

• Contain affected lots and reconstruct die, material, equipment, recipe, operator and test genealogy.
• Decide the corrective qualification path using failure analysis, capability and reliability evidence.
• Rebalance assembly and test loading around qualified windows, bottlenecks and customer criticality.
• Install daily control for excursions, final yield, retest, escapes, cycle time and equipment loss.
• Approve engineering experiments through controlled split-lot protocols and independent Quality review.
• Recover OEE through planned maintenance, changeover and constraint removal without masking downtime.
• Qualify permanent leaders through two customer audits and six months of stable production governance.

Candidate qualifications

• Twenty-eight-plus years in semiconductor assembly and test with multi-line COO or site-head authority.
• Led recovery of failed automotive, industrial or high-reliability semiconductor customer qualification.
• Deep expertise in wire bond, die attach, mould, singulation, final test, reliability and genealogy controls.
• Demonstrated final-yield and OEE recovery without increasing retest dependence or quality escape.
• Experience engaging global semiconductor customers on containment, 8D, qualification and change notification.
• Clear respect for independent Quality authority during high-cost ramp and delivery pressure.
• Track record developing site leaders to withstand demanding customer process audits.

Non-negotiables

• Can be onsite in Hyderabad within three weeks and support round-the-clock production escalation.
• No current relationship with affected customers, key material suppliers or test subcontractors.
• Will stop shipment when genealogy or containment confidence is incomplete.
• Commits to the full twenty-four-month qualification and leadership-transfer term.

1. 49 words maximum. Confirm your earliest Hyderabad start and readiness for continuous-production escalation.
2. 49 words maximum. Which semiconductor qualification failure did you recover, and what yield was sustained afterwards?
3. 49 words maximum. What hidden process tail did your genealogy analysis expose before customer requalification?