Semiconductor Packaging Yield Director — Consulting

The mandate

The narrow problem is unstable yield in two advanced-packaging processes, with loss codes too broad to separate material, equipment and method causes. The assignment excludes routine production management.

The deliverable is a reconciled yield tree, measurement-system assessment, causal experiment record, parameter windows, response plans, verified sustained-yield result and transferred control documentation.

Milestone one is due 31 October 2026 with baseline and measurement validation; milestone two on 15 January 2027 with completed experiments and locked process windows; milestone three on 31 March with twelve-week sustainment, owner certification and final control plan.

The Yield Review Board accepts when loss classification covers ninety-eight percent of rejects, measurement repeatability meets agreed limits, both processes sustain the approved yield threshold for twelve weeks and customer reliability shows no deterioration.

The site supplies genealogy, equipment and metrology data, material lots, recipes, failure-analysis capacity, controlled experiment windows and empowered line engineers. Production protects agreed trial lots from schedule override.

Why this is external work

Site teams are consumed by output recovery and have competing hypotheses tied to their functions. Independent yield specialists can enforce causal testing across equipment, material and process boundaries. Their role ends after sustained performance and knowledge transfer.

What you will own

• Reconcile wafer, package, step and defect yield into the milestone-one loss tree.
• Validate measurement systems before accepting process correlations.
• Design controlled experiments against ranked causal hypotheses.
• Separate incoming-material, equipment-state and recipe interactions.
• Lock parameter windows and out-of-control response plans for milestone two.
• Monitor twelve weeks of sustainment without retrospective exclusions.
• Certify client owners and deliver milestone-three control documentation.

Candidate qualifications

• 22–28 years in semiconductor process, packaging, yield or manufacturing engineering.
• Direct yield-improvement leadership on advanced packaging technologies.
• Deep experience with measurement-system analysis, designed experiments and failure analysis.
• Evidence of sustaining gains through material and equipment variation.
• Knowledge of reliability and customer-qualification consequences.
• Ability to transfer controls to site teams without retaining operational dependence.

Non-negotiables

• Full-time onsite Chennai leadership during experiments and initial stabilisation.
• No equipment or material supplier remuneration.
• Predefined exclusion rules for sustainment reporting.
• Reliability and quality approval required before acceptance.

1. 49 words maximum. Which advanced-packaging yield loss did you resolve, and what experiment disproved the leading hypothesis?
2. 49 words maximum. How would you validate measurement before beginning causal analysis?
3. 49 words maximum. Which genealogy, equipment and material data must be available during week one?