Silicon Product-Identity Recovery Leader — Fabless Semiconductors

The mandate

The product-data vice president departed after a package revision was linked to the wrong device qualification branch in two downstream systems. Shipments were contained before customer use, but engineering change, IP version, die, package, test programme and orderable-part relationships cannot be recreated consistently through partner messages. Three launches now require executive exception review while internal ownership remains fragmented.

The interim must arrive within three weeks for twelve months, leading impact review, identity redesign, partner correction and two launch cycles. A permanent search begins in month four once the future organisation and configuration-accountability boundary are settled. Six weeks of overlap are reserved; the term will not extend for delayed catalogue cleanup, and the incoming executive must inherit before the next major platform family.

Handover requires every active orderable part to resolve to approved IP, design, process, die, package, test, firmware and qualification versions at any effective date; two launches must complete without unexplained configuration exception; and foundry and assembly partner acknowledgements must reconcile. The successor will approve an unseen engineering change and accept residual legacy, partner and lifecycle-state debt.

The interim may quarantine product identities, stop configuration releases, set change evidence, redirect the approved NT$2.1 billion remediation and appoint temporary configuration leads. Customer disclosure, product release, permanent hiring, supplier commercial change and spend above budget require accountable engineering, quality or board approval. The leader cannot sign silicon qualification or override product-safety and customer-acceptance authorities.

EDA replacement, product-roadmap selection and cleansing of obsolete experiments with no support, legal or reuse obligation are outside this assignment. The authority may require reference interfaces but does not own chip architecture, wafer allocation or commercial naming strategy. Work must concentrate on configuration truth governing design, manufacture, qualification, order and supported field product.

Why this seat is open

The revision mismatch exposed how local systems each held valid fragments but no executive owned the effective product configuration across partners. Departure created a critical release bottleneck during active launches. A temporary semiconductor operator must restore trustworthy identity, preserve contained-customer evidence and give permanent leadership an operating change system rather than a one-time reconciliation.

What you will own

• Reconstruct affected device relationships across IP blocks, design revision, process node, die, package, test programme, firmware and qualification evidence.
• Define persistent identities, approved configurations, effective dates, supersession, equivalence and orderability rules across product lifecycle stages.
• Decide which records may support launch, require exception review, need partner confirmation or must remain quarantined from release.
• Redesign engineering-change propagation with source authority, impact analysis, acknowledgement, segregation, timing and rollback evidence.
• Reconcile foundry, assembly, test, commercial and customer references without flattening legitimate partner-specific identifiers into unsafe equivalence.
• Direct two launch-readiness exercises covering package substitution, test revision, firmware dependency, customer variant and late partner acknowledgement.
• Transfer authority through an unseen change approval, partner review and successor acceptance of unresolved legacy and lifecycle identities.

Candidate qualifications

• Held executive product-data, configuration or design-operations authority in a fabless semiconductor, IDM or advanced electronics organisation.
• Governed device, die, package, test, firmware and qualification identity through engineering change and external manufacturing partners.
• Contained a configuration mismatch before or after release and reconstructed the affected product and customer population from evidence.
• Designed effective-dated equivalence and supersession without confusing commercial part names with technically interchangeable configurations.
• Challenged foundry, OSAT, engineering and commercial leaders where each system’s locally valid record produced unsafe global interpretation.
• Handed permanent leadership a tested configuration-control function after live product launches and transparent residual legacy debt.

Non-negotiables

• Available within three weeks for exclusive Taipei service with regular work in Hsinchu and at Asian manufacturing-partner reviews.
• Has carried semiconductor product-configuration authority; generic manufacturing master-data leadership does not satisfy the domain threshold.
• No undisclosed investment or advisory relationship with foundry, OSAT, EDA, lifecycle or configuration-system suppliers involved.
• Will preserve qualification and customer evidence even when product naming or launch timing creates pressure for premature equivalence.

1. 49 words maximum. State your Taipei availability and one semiconductor configuration mismatch whose affected population you bounded.
2. 49 words maximum. How did you distinguish a commercially renamed part from a technically equivalent qualified configuration?
3. 49 words maximum. Which unseen engineering change would you use to test complete partner acknowledgement before handover?