Wafer-Reclaim Contamination Recovery Leader — Analogue Semiconductors

The mandate

The facility operates a monitor-wafer reclaim programme across multiple equipment groups, each with approved reuse classes defined by metallic and film residue limits. The interim leader must rebuild reuse economics and operating protocols, balancing cost efficiency against the segregation and certification requirements that protect both toolsets and product wafers from cross-module transfer risk.

Eight months provide a fixed recovery window. The first thirty days secure wafer populations, classify exposed tools and establish product containment. Months two through four reconstruct residue pathways, validate clean and strip capability and rebuild reuse classes. Months five through seven qualify supplier and internal flows across complete cycles. The final month installs a permanent leader and transfers tool, supplier and wafer-release decisions.

Handover is achieved when every reclaimed wafer traces to origin, films, cleaning, inspection, use class and retirement; exposed equipment has evidence-based disposition; and three reuse cycles meet contamination limits without product excursion. The successor must chair one ambiguous wafer classification and reject a cost-driven routing exception. Inventory removed from the system without disposition cannot count as risk closure.

The leader may quarantine wafers and tools, stop reclaim routing, approve reuse classes and inspection limits, direct supplier corrective action and commit MYR 12 million within the authorised recovery envelope. They decide monitor-wafer release after process and quality consultation. Product specifications, customer notification, long-term supplier awards, fab expansion and environmental permits remain with accountable executives.

Excluded are redesigning device processes, owning all fab contamination, determining supplier liability, replacing the manufacturing execution system or setting corporate waste targets. The mandate covers wafer reclaim custody and contamination risk for defined tool groups. Legal claims, employee discipline and external environmental representations follow separate governance supported by preserved samples and route evidence.

Why this seat is open

Reclaimed wafers move across process boundaries and can carry histories that ordinary inventory systems were not designed to represent. The departure removed the executive able to quarantine both material and valuable tools while evidence is reconstructed. Temporary authority can contain the excursion now and leave a permanent owner with validated reuse classes instead of blanket disposal.

What you will own

• Reconcile wafer identity, original process films, reclaim cycles, cleaning recipes, inspections, carriers, routing and retirement evidence.
• Map metallic, ionic, organic, particle and film-memory pathways across wafer surfaces, backsides and equipment groups.
• Establish reuse classes by process sensitivity, residue history, cleanability, measurement confidence and maximum cycle count.
• Direct product and tool disposition using blank monitors, surface analysis, chamber history and process-specific contamination limits.
• Qualify external reclaim through custody, chemistry, equipment dedication, sampling, certificates and retained reference wafers.
• Redesign marking, carrier, route and system controls so an unauthorised class movement is prevented or immediately visible.
• Transfer exposure maps, approved reuse matrices, supplier actions, open tools and successor-led classification evidence.

Candidate qualifications

• Led semiconductor contamination-control or wafer-reclaim recovery across multiple process modules and product sensitivities.
• Can evidence an excursion traced through monitor-wafer history, residues or cross-equipment routing.
• Understands surface and backside contamination, analytical detection, film memory, cleaning, carriers and equipment dedication.
• Has balanced reclaim economics with conservative product and tool disposition under incomplete evidence.
• Directed external reclaim suppliers and fab teams through physical sampling and traceable route reconstruction.
• Developed a successor able to reject apparently clean wafers whose history does not support the intended use.