Director of Advanced Packaging — Interim, Microelectronics

The mandate

A heterogeneous package failed thermal cycling because substrate warpage and fine-pitch interconnect defects interact unpredictably. The technical director resigned after successive material changes created data that cannot be compared across builds.

The interim must begin within four weeks for sixteen months through design-of-experiments, qualification and supplier transfer. The temporary programme closes once a permanent packaging head accepts the released process and supplier control plan.

Handover requires qualification passed across temperature, humidity and mechanical stress, assembly yield above ninety-two per cent for ten lots, stable critical-material supply, and the successor approving one complete deviation and change cycle.

The director may select experiments, hold builds and approve sample materials below ₹60 lakh. Package architecture changes affecting customer interfaces, new equipment above ₹2 crore and reliability waivers require CTO governance; Quality alone approves formal qualification status.

Die design, board-level system validation and mass-market pricing are outside scope. The programme must industrialise the approved package concept rather than expand into adjacent product development.

Why this seat is open

Serial material changes destroyed experimental comparability without resolving the failure. Departure of the technical owner has left suppliers advancing incompatible hypotheses. A finite packaging authority must restore controlled learning and transfer a qualified process to permanent leadership.

What you will own

• Reconstruct comparable build history across substrate, underfill, bump, reflow, warpage and interconnect outcomes.
• Decide a statistically powered experiment sequence that isolates material, geometry and process interactions.
• Establish metrology correlation and measurement-system capability across internal and supplier laboratories.
• Approve package process windows and critical-material specifications from validated evidence.
• Govern reliability lots with locked configuration, sample genealogy and failure-analysis protocol.
• Transfer released controls into supplier process audits, change notification and incoming evidence.
• Induct the permanent head through one live deviation, material change and qualification review.

Candidate qualifications

• More than twenty-two years in semiconductor packaging development and high-volume industrialisation.
• Led qualification of advanced flip-chip, fan-out, 2.5D, heterogeneous or comparable fine-pitch packages.
• Deep command of warpage, interconnect, underfill, substrate materials, reflow and package reliability physics.
• Skilled in designed experiments and measurement-system analysis across multiple supplier laboratories.
• Experience rejecting noisy build data and re-establishing configuration discipline under launch pressure.
• Demonstrated transfer of a development process into capable supplier production and permanent ownership.

Non-negotiables

• Available in Chennai within four weeks and for frequent OSAT and material-supplier travel.
• Independent of substrate, underfill and packaging suppliers under consideration.
• Will not accept reliability evidence from uncontrolled configuration builds.
• Can commit for sixteen months through qualification and successor handover.

1. 49 words maximum. Confirm availability and willingness to travel frequently to Asian packaging suppliers.
2. 49 words maximum. Which package reliability failure did you isolate, and what interaction caused it?
3. 49 words maximum. What measurement correlation did you establish before comparing supplier build results?