Interim Director, Product Engineering — Semiconductor Yield

The mandate

A field failure traced to marginal test coverage has triggered a lot hold and suspension of the product-engineering director during quality review. Foundry, assembly-test and design teams disagree on the affected population and whether screening can protect pending customer shipments.

The interim must begin within two weeks for nine months, spanning containment, corrective action and two qualified production lots. A permanent search starts after root cause is independently accepted, with extension possible for one month if customer qualification moves.

Handover is complete when affected lots and customers are bounded, root cause and screening efficacy are validated, two production lots meet yield and reliability thresholds, the hold is lifted through approved evidence, and the successor signs the first product release.

The interim may hold lots, change test limits, require failure analysis and direct ₹6 crore of recovery spend. Product recall, scrap above ₹10 crore, material specification change, permanent leadership hire and shipment against unresolved severe risk require executive or quality council approval.

New-product architecture, foundry sourcing and commercial allocation are outside scope. The director will provide release evidence but will not decide customer pricing or long-term fab strategy.

Why this seat is open

The suspended leader cannot independently reassess test coverage and release decisions under review. Technical ownership is split across companies and internal functions with different cost exposure. A temporary director can impose one evidence chain until production is demonstrably qualified.

What you will own

• Bound affected wafer, assembly, test and customer populations using traceability and failure signatures.
• Decide lot holds, screening and release conditions from quantified escape and false-reject risk.
• Lead cross-functional root-cause proof across design margin, process, package, test and operating conditions.
• Approve revised test coverage only after bench, tester and field correlation meet explicit thresholds.
• Reconcile yield movement, screening loss, scrap, customer exposure and recovery cost.
• Qualify two production lots through reliability and customer acceptance evidence.
• Transfer traceability, root-cause records, test changes, supplier actions and remaining customer commitments to the successor.

Candidate qualifications

• Led semiconductor product engineering, yield or test organisations at director level.
• Contained a field-quality excursion across foundry, assembly and test partners.
• Established lot and customer traceability for a complex failure population.
• Correlated bench, automated test and field conditions to validate screening.
• Exercised shipment-hold authority despite revenue or allocation pressure.
• Managed customer qualification and supplier corrective action to accepted release.

Non-negotiables

• Available in Hyderabad within fourteen days.
• No current role with the foundry, OSAT or independent failure-analysis provider.
• Will not release held lots on expected yield alone.
• Must have signed production release after a semiconductor quality excursion.

1. 49 words maximum. Confirm availability and disclose any foundry, OSAT or customer conflict.
2. 49 words maximum. Describe a yield excursion you bounded and the traceability key used.
3. 49 words maximum. Which correlation result is necessary before screening can support release?